AMAOE SAM:17 BGA Reballing Stencil for SAMSUNG S22 Plus Ultra Tin Planting Steel

The AMAOE SAM:17 BGA Reballing Stencil for Samsung S22 Plus Ultra Tin Planting Steel is a precision repair tool designed for IC chip reballing and tin planting work on Samsung S22 series devices. This AMAOE SAM:17 BGA reballing stencil for Samsung S22 Plus Ultra tin planting steel ensures accurate alignment and consistent solder ball placement during motherboard repair.

The AMAOE SAM:17 BGA reballing stencil for Samsung S22 Plus Ultra tin planting steel is made from high-quality steel, providing durability and precision for professional repair technicians working on CPU and IC reballing tasks.

Key Features

• AMAOE SAM:17 BGA Reballing Stencil for Samsung S22 Plus Ultra Tin Planting Steel
• Designed for Samsung Galaxy S22 / S22 Plus / S22 Ultra
• Used for BGA reballing and tin planting work
• High-precision steel stencil for accurate IC alignment
• Durable and reusable material for long-term use
• Suitable for professional motherboard repair

Advantages

• AMAOE SAM:17 BGA stencil ensures precise solder ball placement
• Improves accuracy in IC and CPU reballing
• Durable steel design for repeated use
• Helps achieve clean and stable soldering results
• Ideal for mobile repair technicians and service centres

Package Includes

1 × AMAOE SAM:17 BGA Reballing Stencil for Samsung S22 Plus Ultra Tin Planting Steel