KINGBO RMA-218 Soldering flux Solder 10cc BGA Reball Mobile Phone PCB

Product Details:-

Item: KINGBO RMA-218 Soldering flux Solder 10cc BGA Reball Mobile Phone PCB PS4 - UK

Condition: New

Type: Soldering flux

Key Features:
 Reflow/Reball Tacky flux Mobile Phone Motherboard PS4 BGA Repair
PLUNGER AND DISPESING TIP SUPPLIED
High Viscosity No-Clean flux that can be used for Rework, Sphere or Pin Attachment to BGA, CGA and CSP Packages, and assembly operations such as Flip Chip attachment to PWB substrates. Good formula for BGA reballing / balls worksit can stick the balls much more.
Can Reflow using Hot Air, Infrared, Oven or Nitrogen Environment. Kingbo RMA-218 flux Leaves Bright Shiny Solder Joints after Reflow