The MECHANIC ZC50 158 Soldering Paste is a high-quality flux paste specially designed for mobile phone motherboard and CPU reballing, chip soldering, and IC repair.
With excellent viscosity, thermal stability, and wetting performance, it ensures smooth, precise, and strong solder joints during delicate electronic repairs.

Perfect for professional technicians and DIY repair experts, this 50G paste provides consistent flow and clean results, reducing oxidation and improving heat transfer during soldering.

Key Features

• Condition: 100% Brand New

• Type: Soldering / Reballing paste

• Brand: MECHANIC

• Model: ZC50-158

• Weight: 50 Grams

• Application: Mobile phone motherboard, CPU, and IC chip repair

• Performance: High-activity flux for strong bonding and smooth soldering

• Quality: Stable composition for clean, precise reballing results

• Usage: Suitable for hot air rework stations, reflow, and manual soldering

Package Includes

• 1 × MECHANIC ZC50 158 Soldering Paste (50G)