MECHANIC XG-XG30 Solder Soldering paste smd BGA SMT Stencil 183 degrees 16g

Brand: HK MECHANIC
Model: XG-XG30

The MECHANIC XG-XG30 soldering paste is a high-quality professional-grade flux ideal for SMD, BGA, and SMT rework or repair. Designed for precision electronics soldering, it offers excellent wettability, strong adhesion, and a smooth application process, ensuring superior connectivity and performance.

 Features:

• 100% Original and Brand New

• Alloy Composition: Sn63/Pb37

• Micron Size: 24–45μm

• MESH: -325/+500

• Melting Point: 183°C

• Ensures clean, shiny joints and stable electrical conductivity

• Ideal for fine-pitch components and stencil soldering

 Safety Notes:

1. Harmful if inhaled or swallowed.

2. Danger of cumulative effects with prolonged exposure.

3. Keep away from food, drinks, and animal feed.

4. Do not eat, drink, or smoke while handling.

5. Avoid skin contact; in case of ingestion, seek medical advice immediately.

6. Store in a cool, dry place with the container tightly closed.

Package Includes:
1 × MECHANIC XG-XG30 Soldering paste (16g)