The MECHANIC XG-Z40 Solder Paste (10cc / 35g) is a high-performance SMD, BGA, and SMT soldering paste designed for precise surface mounting and electronic component repair. Composed of fine solder microparticles (20–38 microns), it ensures clean, strong, and reliable solder joints for professional PCB and micro-soldering applications. Ideal for technicians performing BGA reballing, CPU repair, or PCB assembly using hot air or reflow methods.

Key Features

• High Viscosity: The thick consistency prevents spreading during heating for clean, controlled soldering.

• Clean and Residue-Free: Produces neat joints without leaving sticky or corrosive flux residue.

• Precision Application: Comes in a 10cc syringe-style dispenser for accurate and easy spot application.

• Versatile Usage: Perfect for soldering without a soldering iron — can be used with a hot air gun, hot plate, infrared table, gas torch, or lighter.

• Professional Quality: Commonly used in radio and electronics industries for surface-mount component (smd) assembly on printed circuit boards.

Technical Characteristics

• Brand: MECHANIC

• Model: XG-Z40

• Composition: Sn 63% / Pb 37%

• Flux Type: IPX3

• Solder Microparticles: 20–38 microns

• Melting Point: 183°C

• Capacity: 10ml

• Weight: 35g

Package Includes

• 1 × MECHANIC XG-Z40 Solder Paste (10cc / 35g)