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The RELIFE RL-422-IM Halogen Free Flux Paste (LEAD-FREE) for Chips Phone BGA SMD PCB is designed for professional microsoldering and electronic repair applications. This RELIFE RL-422-IM halogen free flux paste is suitable for chip-level repair on mobile phones, BGA rework, smd soldering, and PCB maintenance.
Being lead-free and halogen-free, this flux paste helps improve solder flow, reduce oxidation, and achieve clean, reliable solder joints on delicate components. The RL-422-IM flux paste for chips phone BGA SMD PCB is widely used by technicians for motherboard repair and precision soldering work.
Brand: RELIFE
Model: RL-422-IM
Type: Halogen Free Flux Paste
Specification: LEAD-FREE
Application: Chips, Phone Motherboard Repair, BGA, smd, PCB Soldering
Improves solder wetting and reduces oxidation
Designed for professional microsoldering work
Halogen-free and lead-free formulation for safe repair work
Improves solder flow and joint reliability
Ideal for BGA, SMD, and PCB soldering applications
Helps achieve clean and precise soldering results
Suitable for mobile phone motherboard and chip-level repair
Trusted flux paste for repair technicians and service centres
1 × RELIFE RL-422-IM Halogen Free Flux Paste (LEAD-FREE) for Chips Phone BGA SMD PCB
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