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AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCI
AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCI
AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCI
AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCI

AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCI

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AMAOE EMMC3 BGA Reballing Stencil For Android

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AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCI

AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCI

 

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8513369
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Description
AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCI
The AMAOE EMMC3 BGA Reballing Stencil is a precision tool designed for Android NAND Flash, EMMC, EMCP, UFS, LPDDR, and PCI chip reballing and repair. Made from high-quality, heat-resistant stainless steel, it ensures accurate solder ball alignment, smooth tin application, and long-lasting durability for professional IC rework. AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCIE 153 162 169 200 221 254 60 70 186 200 Tin Net

Features:
Condition: 100% Brand New
Type: BGA Reballing Stencil / Tin Soldering Template
Model: AMAOE EMMC3
Material: Premium stainless steel
Function: For NAND, EMMC, UFS, LPDDR, and PCI chip reballing
Compatibility: Universal for Android devices

Package Includes:
1 × AMAOE EMMC3 BGA Reballing Stencil
Protective Packaging for Safe Delivery

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8513369
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  • AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCI
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  • Total price: £8.53
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