Amaoe U-QSU4 BGA Reballing Solder Template Stencil for Qualcomm Snapdragon CPU

Description:
The Amaoe U-QSU4 BGA Reballing Stencil is a high-precision soldering template designed for reballing Qualcomm Snapdragon CPU chips. Crafted from durable, heat-resistant stainless steel, it ensures accurate solder ball alignment and even distribution during IC and CPU rework. Perfect for professional repair technicians performing chip-level motherboard repairs.

Features:
Condition: 100% Brand New
Type: BGA Reballing Solder Template / Stencil
Model: Amaoe U-QSU4
Compatibility: Qualcomm Snapdragon CPU Series
Material: Premium-grade stainless steel, anti-warp and corrosion-resistant
Function: Aids precise solder ball placement during BGA and IC rework
Design: Ultra-fine cut holes for uniform soldering and smooth reflow
Usage: Suitable for mobile phone, tablet, and motherboard chip repair

Package Includes:
1 × Amaoe U-QSU4 BGA Reballing Solder Template Stencil for Qualcomm Snapdragon CPU