Amaoe QU7 BGA Reballing Stencil for CPU SM4250 SM7150 SM6125 SM7225 SM7250 SM735

Description:
The Amaoe QU7 BGA Reballing Stencil is a high-precision template designed for CPU and IC reballing work on Qualcomm chipsets such as SM4250, SM7150, SM6125, SM7225, SM7250, and SM735. Made from high-quality stainless steel, it ensures accurate solder ball placement, perfect alignment, and long-lasting performance during rework and repair.

Features:
Condition: 100% Brand New
Type: BGA Reballing Stencil
Model: Amaoe QU7
Compatibility: CPU Models – SM4250 / SM7150 / SM6125 / SM7225 / SM7250 / SM735
Material: Durable stainless steel, heat-resistant and anti-warp
Function: Assists in precise solder ball reballing for BGA and IC chips
Design: High-accuracy holes for smooth and consistent solder placement
Usage: Suitable for mobile phone motherboard and chip-level repair

Package Includes:
1 × Amaoe QU7 BGA Reballing Stencil for CPU SM4250 / SM7150 / SM6125 / SM7225 / SM7250 / SM735