2UUL DW01 Mobi Desoldering Wick wire 2.0mm width for PCB IC BGA CPU Phone

The 2UUL DW01 Mobi Desoldering Wick Wire is a high-quality copper braid designed to remove excess solder efficiently from PCB, IC, BGA, and CPU components. With a 2.0mm width, it delivers fast solder absorption and clean results.

Features:
Condition: 100% Brand New
Type: Desoldering Wick Wire / Solder Removal Braid
Model: 2UUL DW01 Mobi
Width: 2.0mm
Material: Oxygen-free copper braid with anti-oxidation coating
Function: Removes unwanted solder from circuit pads, ICs, and PCBs
Performance: Excellent solder absorption with minimal residue
Usage: Suitable for phone, tablet, and motherboard rework applications

Package Includes:
1 × Roll of 2UUL DW01 Mobi Desoldering Wick Wire (2.0mm Width)