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Apple iPhone 16 Plus Pro Max e A18/A18 pro BGA Reballing Stencil Tin Soldering
Apple iPhone 16 Plus Pro Max e A18/A18 pro BGA Reballing Stencil Tin Soldering
Apple iPhone 16 Plus Pro Max e A18/A18 pro BGA Reballing Stencil Tin Soldering
Apple iPhone 16 Plus Pro Max e A18/A18 pro BGA Reballing Stencil Tin Soldering

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Apple iPhone 16 Plus Pro Max e A18/A18 pro BGA Reballing Stencil

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Apple iPhone 16 Plus Pro Max e A18/A18 pro BGA Reballing Stencil Tin Soldering

Apple iPhone 16 Plus Pro Max e A18/A18 pro BGA Reballing Stencil Tin Soldering

 

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1076109
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Description

Apple iPhone 16 Plus Pro Max e A18/A18 pro BGA Reballing Stencil Tin Soldering

Perform precise chip repairs with the BGA Reballing Stencil Tin Soldering Template for Apple iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max (A18 / A18 Pro Chip). Designed for professional technicians, this high-quality stencil ensures accurate alignment and efficient soldering during IC chip reballing and motherboard repair. Ideal for advanced micro-soldering and rework projects.

Key Features

  • Condition: 100% Brand New

  • Type: BGA Reballing Stencil / Tin Soldering Template

  • Compatibility: Apple iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max (A18 / A18 Pro Chip)

  • Material: High-quality stainless steel for durability and heat resistance

  • Function: Used for precise soldering, chip alignment, and reballing A18 / A18 Pro ICs

  • Design: Laser-cut holes for accurate solder ball placement and professional-grade results

  • Usage: Ideal for micro-soldering, IC repair, and logic board maintenance

Package Includes

  • 1 × BGA Reballing Stencil Tin Soldering Template for iPhone 16 Series (A18 / A18 Pro)

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Product Details
1076109
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