Apple iPhone 15 Plus Pro Max A17/A15 BGA Reballing Stencil Tin Soldering

The Apple iPhone 15 Series A17/A15 BGA Reballing Stencil is a high-precision tin soldering template designed for reballing all the chips / ICs on iPhone 15 logic boards. Built from premium high-temperature stainless steel, this stencil provides perfect alignment and even tin distribution during BGA rework, helping technicians restore or replace IC chips like CPU, GPU, NAND, and PMIC with professional accuracy.

Features:

• Condition: 100% Brand New

• Type: BGA Reballing Stencil / Tin Soldering Template

• Material: High-quality, heat-resistant stainless steel

• Compatibility: iPhone 15 / 15 Plus / 15 Pro / 15 Pro Max (A17 / A15 Chips)

• Function: Stencil for reballing all the chips / IC on iPhone 15 series

• Precision: Laser-cut for accurate solder ball placement and even tin flow

• Durability: Corrosion-proof and reusable for multiple repair sessions

Package Includes:

• 1 × A17/A15 BGA Reballing Stencil for iPhone 15 Series

• Protective Packaging for Safe Shipping