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Apple iPhone 14 Plus Pro Max A16/A15 BGA Reballing Stencil Tin Soldering
Apple iPhone 14 Plus Pro Max A16/A15 BGA Reballing Stencil Tin Soldering
Apple iPhone 14 Plus Pro Max A16/A15 BGA Reballing Stencil Tin Soldering
Apple iPhone 14 Plus Pro Max A16/A15 BGA Reballing Stencil Tin Soldering

Apple iPhone 14 Plus Pro Max A16/A15 BGA Reballing Stencil Tin Soldering

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Apple iPhone 14 Plus Pro Max A16/A15 BGA Reballing Stencil

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Apple iPhone 14 Plus Pro Max A16/A15 BGA Reballing Stencil Tin Soldering

Apple iPhone 14 Plus Pro Max A16/A15 BGA Reballing Stencil Tin Soldering

 

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6931320
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Description

Apple iPhone 14 Plus Pro Max A16/A15 BGA Reballing Stencil Tin Soldering

The Apple iPhone 14 Series A16/A15 BGA Reballing Stencil is a professional-grade tin soldering template specially designed for reballing all the chips and ICs on iPhone 14 series logic boards. Built from high-quality stainless steel, this stencil ensures precise solder ball placement and perfect alignment during chip-level repairs, making it ideal for restoring or replacing CPU, GPU, NAND, and other ICs.

Features:

  • Condition: 100% Brand New

  • Type: BGA Reballing Stencil / Tin Soldering Template

  • Material: High-quality, heat-resistant stainless steel

  • Compatibility: iPhone 14 / 14 Plus / 14 Pro / 14 Pro Max (A16 / A15 Chips)

  • Function: Stencil for reballing all the chips / IC on iPhone 14

  • Precision: Laser-cut holes ensure accurate tin distribution and perfect solder ball alignment

  • Durability: High temperature and corrosion-resistant for repeated professional use

Package Includes:

  • 1 × A16/A15 BGA Reballing Stencil for iPhone 14 Series

  • Protective Packaging for Safe Delivery

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Product Details
6931320
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Buy it with

  • Apple iPhone 14 Plus Pro Max A16/A15 BGA Reballing Stencil Tin Soldering
  • +
  • AMAOE EMMC3 BGA Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCI
  • Total price: £5.73
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