RELIFE Parallel 45 Degree Multi-Purpose reballing BGA Stencil 0.3 0.35 0.4 0.5

The RELIFE Parallel 45° BGA Stencil is a high-precision reballing tool designed for use in parallel 45° orientation to improve solder ball placement accuracy. It supports multiple pitch sizes—0.3 mm, 0.35 mm, 0.4 mm, and 0.5 mm—making it ideal for a variety of BGA, IC, and chip reballing tasks across many devices.

Features:

• Condition: 100% Brand New

• Type: Multi-Purpose Reballing BGA Stencil

• Model: RELIFE Parallel 45°

• Supported Pitches: 0.3 / 0.35 / 0.4 / 0.5 mm

• Orientation: Parallel 45° layout for improved solder alignment

• Material: High-quality stainless steel, heat-resistant, corrosion-proof

• Function: Precisely aligns and applies solder balls during BGA/IC reflow

• Usage: Suitable for motherboard, chip-level, and device repair operations

Package Includes:
1 × RELIFE Parallel 45° Multi-Purpose Reballing BGA Stencil