MECHANIC Soldering ZW50 183 (50G) paste for mobile phone CPU repair reballing

The MECHANIC ZW50 Solder Paste (50g, 183°C) is a premium-quality low-temperature soldering paste specially formulated for mobile phone CPU repair, BGA reballing, and SMD rework. With its smooth consistency and excellent wetting properties, this paste ensures reliable chip bonding, clean solder joints, and consistent performance in professional micro-soldering applications.

Key Features

• Condition: 100% Brand New

• Brand: MECHANIC

• Model: ZW50

• Type: Low Temperature Solder paste

• Weight: 50g

• Melting Point: 183°C

• Composition: High-purity tin alloy for clean and conductive joints

• Function: Provides excellent adhesion, quick melting, and minimal residue

• Usage: Ideal for mobile phone CPU repair, BGA reballing, smd soldering, and PCB rework

• Performance: Fast melting, stable conductivity, and strong mechanical bonding

Package Includes

• 1 × MECHANIC ZW50 Solder Paste (50g, 183°C)