MECHANIC Soldering GW50 217 (50G) paste for mobile phone CPU repair reballing

The MECHANIC GW50 Solder Paste (50g, 217°C) is a high-performance BGA reballing and CPU repair solder paste designed for precision micro-soldering applications. Ideal for mobile phone motherboard repair, chip rework, and SMD soldering, this premium-quality paste offers strong adhesion, smooth flow, and consistent melting performance to ensure perfect solder joints every time.

Key Features

• Condition: 100% Brand New

• Brand: MECHANIC

• Model: GW50

• Type: Solder paste for CPU & BGA Reballing

• Weight: 50g

• Melting Point: 217°C

• Composition: High-purity tin alloy for strong and conductive solder joints

• Function: Ensures stable soldering, excellent wetting, and strong chip bonding

• Usage: Perfect for mobile phone CPU repair, BGA reballing, smd soldering, and PCB rework

• Performance: Fast melting, low residue, and reliable heat transfer for professional results

Package Includes

• 1 × MECHANIC GW50 Solder Paste (50g, 217°C)