XG-40 30g BGA CPU LED 183 Melting Point Welding Flux Paste Soldering lead free

The XG-40 Lead-Free Soldering Flux Paste (30g, 183°C Melting Point) is a high-performance BGA, CPU, and LED welding flux designed for precise and reliable soldering applications. It ensures smooth solder flow, strong bonding, and excellent conductivity while minimizing oxidation. Ideal for professionals working on electronics repair, PCB rework, and micro-soldering projects.

Key Features

• Condition: 100% Brand New

• Model: XG-40

• Type: Lead-Free BGA Soldering flux paste

• Weight: 30g

• Melting Point: 183°C

• Material Composition: High-purity tin alloy flux for stable, non-corrosive solder joints

• Function: Improves wetting, prevents oxidation, and enhances solder adhesion

• Usage: Suitable for BGA reballing, CPU soldering, LED repair, and PCB rework

• Performance: Smooth application, minimal residue, and consistent heat performance

Package Includes

• 1 × XG-40 Lead-Free BGA Soldering Flux Paste (30g, 183°C)