SAM:19 BGA Reballing Stencil For Samsung S23/24/Ultra snapdragon 8GEN2/3 SM3550

Amaoe SAM-19 Stencil for 8Gen2 SM8550 / 8Gen3 SM8650 CPU – S23 / S23 Ultra / S24 / S24 Ultra**

This SAM:19 BGA Reballing Stencil is a precision tool designed for professional chip-level repair on Samsung flagship models using Snapdragon 8 Gen 2 and 8 Gen 3 processors.
Engineered for accuracy, the stencil ensures clean, consistent solder paste application on CPU pads, making it ideal for reballing, reworking, and advanced PCB repair.

Manufactured from durable stainless steel, the stencil features perfectly aligned apertures that match the layout of supported CPUs, ensuring reliable performance and long-term reusability.
It is suitable for technicians working on Samsung S23 / S23 Ultra / S24 / S24 Ultra devices and any mainboards using SM8550 / SM8650 chips.

Key Features

• Condition: 100% Brand New

• Type: BGA Reballing Stencil

• Compatibility: Samsung S23 / S23 Ultra / S24 / S24 Ultra – Snapdragon 8Gen2 (SM8550) / 8Gen3 (SM8650)

• Function: Precise solder paste application for CPU pad reballing

• Design: Micro-aperture layout for clean, accurate solder deposition

• Usage: Suitable for BGA CPU reballing, repair, and rework processes

Advantages

• High Precision: Apertures perfectly match CPU pad patterns for accurate soldering.

• Durable Material: Stainless steel construction ensures long-term, repeated use.

• Professional Quality: Ideal for expert rework technicians and repair labs.

• Stable Performance: Ensures consistent solder flow and pad alignment.

• Multi-Model Support: Compatible with multiple Samsung flagship models.

Package Includes

• 1 × SAM-19 BGA Reballing Stencil for Samsung S23 / S24 Series (Snapdragon 8Gen2 / 8Gen3)