SUGON 8650Pro 1300W Hot Air Rework Station SMD Welding solder Curve Mode

The SUGON 8650Pro 1300W Hot Air Rework Station SMD Welding Solder Curve Mode is an upgraded professional hot air gun designed for mobile phone PCB, BGA, smd soldering and desoldering repair. This SUGON 8650 PRO hot air rework station features a newly added curve heating mode, improved airflow design, and multiple precision nozzles for advanced electronics repair.

The SUGON 8650Pro 1300W hot air rework station supports three heating modes, including the curve mode which can be used with a dedicated bracket to free both hands during motherboard repair. With upgraded heating elements, wired handle control, and improved thermal efficiency, this station is ideal for professional repair technicians.

 Key Features

1. Curve Heating Mode Upgrade
   The SUGON 8650Pro curve mode allows programmable temperature and airflow control, enabling hands-free operation when used with the bracket.

2. High Power & Efficiency
   1300W output provides fast heating, uniform airflow, and stable temperature control for BGA, smd, and PCB repair.

3. Hot-Swappable Heating Core
   New knob-type heating element design allows easy replacement by hand without screws. Comes with 7A and 11B heating elements.

4. Upgraded Wired Handle
   Improved ergonomic design with wire control, smaller buttons, and 4 memory channels for quick parameter recall.

5. Advanced Curve Mode Controls

   • CH1 / CH2: Temperature adjustment

   • CH3 / CH4: Air volume control

   • Cold air button: Activates curve mode (long press 3s to reset)

6. Improved Bracket Design
   Upgraded 252 rack includes an additional front plug socket compared to the older 251 version.

7. Precision Nozzles Included
   Added 15×15mm and 15×17mm square nozzles with dedicated holder for precise motherboard soldering and chip removal.

Product Parameters

• Model: SUGON 8650 PRO

• Power: 1300W

• Temperature Range: 100℃ – 550℃

• Machine Size: 190 × 260 × 170 mm

• Carton Size: 25 × 25 × 16 cm

• Inner Box Weight: 8.7 kg

Applications

• Mobile phone PCB repair

• BGA chip soldering & desoldering

• smd component rework

• Motherboard IC removal and installation

• Professional electronics repair workshops

Package List

• Power Cord ×1

• 8650Pro Host ×1

• 252 Bracket ×1

• Wind Nozzles ×6

• Wind Nozzle Gaskets ×2

• 11B Integrated Heating Core ×1

• Instruction Manual ×1

• 252 Wind Gun Rack Assembly Conversion Parts ×4